A brand-new, unused, unopened, undamaged item in its original packaging, ready to solder.
218S7EBLA12FG SB700
Part Number
218S7EBLA12FG
Manufacturer
AMD
BGA Alloy
No Pb/Lead Free
Date Code
11+
Package/Case
360
Description
Original new
Technical Support
BGA CHIPSET OBSERVE PRECAUTIONS FOR HANDLING
BGA Chips are MOISTURE SENSITIVE DEVICES. Devices require baking, before mounting, Here is the general bake-out process, Lay the BAG on the tray, and put it in to a baking dry cabinet. Set the temperature and time as: 125℃±5℃ x 24 hours or 80℃±5℃ x 48 hours
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Additional information
Weight
0,10 kg
Dimensions
10 × 10 × 10 cm
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