¡Ventiva has launched its innovative ICE9 thermal management system, which operates completely silently and with no moving parts! 🥳 This new product will be introduced with devices featuring processors up to 25W at CES, but is expected to be able to cool partner laptop designs with up to 40 watts TDP by 2027.

According to Ventiva, the ICE9 uses the company's Ionic Cooling Engine (ICE), allowing it to cool electronic devices without any moving parts. This system is said to be much more efficient than the Frore AirJet solid-state active cooling system launched a couple of years ago, although it's still slightly less efficient than a real fan.

However, what makes Ventiva’s ICE9 thermal management suite better than a regular fan is its completely silent operation and ultra-compact size, measuring just 12mm in height. 😍 This makes it the ideal solution for thin and light laptops, allowing original equipment manufacturers (OEMs) to use relatively powerful processors without worrying about overheating. Furthermore, beyond allowing manufacturers to create slimmer devices, it could also make it easier to integrate additional components to expand the functionality of their devices, such as Framework’s dual M.2 module, which slots into the empty space between the fan on its Framework Laptop 16 Expansion Bay.

“Our ICE technology is transforming the electronics market, enabling a new wave of quiet and intelligent thermal management solutions. Our most recent results underscore the remarkable scalability of our ICE9 solution,” said Carl Schlachte, CEO of Ventiva. “Initially demonstrated within the ‘thin and light’ laptop category with around 15W TDP, the ICE9 device now enables laptop manufacturers to extend these benefits to higher-performance systems, paving the way for the launch of entire families of silent computing products.”

The company mentions that there are ICE9 solutions that can handle up to 25 watts TDP right now, which means it will be able to work with some of the new low-power, highly efficient processors from AMD and Intel, as well as Qualcomm's Snapdragon X chips. Additionally, they are collaborating with OEMs to develop solutions of cooling that can handle up to 40 watts TDP, allowing them to smoothly handle some of the latest AI processors from Intel and AMD. What's more, they are open to partners implementing hybrid solutions' that combine ICE9 and fans for ultra-quiet computing.

Although Ventiva is currently focusing on laptops for ICE9 applications, it could also be used in a variety of other devices, such as smartphones and tablets, especially given its small footprint. However, it has one weakness: ICE9 has such low static pressure that OEMs cannot simply integrate it into their current designs if they want to maximize the technology's cooling performance.

Instead, they should consider a hybrid solution or build a case specifically designed for the product, allowing them to efficiently transfer heat away from all of the laptop's heat-generating parts so that ICE9 can cool it directly, rather than relying on the airflow a typical fan would generate. If laptop makers can solve this problem, we could be poised to see impressive leaps in silent computing performance. 💻✨