Intel Comments on Alder Lake Flex

Intel Comments on Alder Lake Flex

Intel comments on Alder Lake warping and bending issues, void of warranty with modifications.

Intel has finally given us some in-depth commentary on an issue that’s plagued its newest chip lineup: the Alder Lake processors that dominate our list of the best gaming CPUs have suffered from a vexing problem for enthusiasts, as the new chips, with their elongated design and the way they sit in the socket, have been known to bend and warp when placed into a motherboard socket.

As you can see in the very short video below, this creates a gap that decreases contact between the cooler and the chip, ultimately hampering the cooler's ability to keep the chip cool.

This can lead to much higher chip temperatures (impact changes, typically around 5C).

The condition, referred to as 'buckling', 'disfigurement' or 'bowing' in PC enthusiast circles, is the result of the tremendous pressure exerted in the middle of the chip causing the IHS (Integrated Heat Spreader) to bend, and often results in very creative solutions chosen to compensate for the problem.

This can range from customers using custom-built gadgets to extreme overclockers like Splave cutting a socket out of a motherboard to regain lost cooling capacity.

Intel finally commented on the issues, stating that this condition is not a problem and that changing the socket can void the chip's warranty.

He said to Tom's Hardware:

«We are not receiving any reports of 12th Gen Intel Core processors running outside of the specifications due to changes to the internal heatsink (IHS).

Our internal notes detail that the IHS in the processors 12th Gen desktop motherboards have the potential to experience rapid deflection after installation into the socket.

Such deflection is estimated to be minor and does not cause the processor to run out of specification.

We strongly advise against making any changes to the socket or loading mechanism alone.

These edits would result in the processor being out of date and may void product warranties.

—Intel representative to Tom's Hardware.

Intel's statement admits the condition exists but says it does not cause performance issues.

However, it is essential to take these comments in context: First, deviation is a engineering term to describe "the degree to which part of a structural element shifts under a load (as it becomes distorted)," which is the technical term for what the community of enthusiasts calls "bending," "warping," or "folding."

Next, Intel's statement that it has not received any reports of chips running outside of specifications means that the deviation does not cause the chip to run hotter than the maximum temperature of 100°C and that any increased thermal temperature does not cause the chip to drop below its base frequency.

That's not to say there isn't a cooling hit, it's just not severe enough to cause the chip to starve itself of data.

However, there are some nuances in Intel's definition of detailed performance: Intel it's not guarantees that it will reach the nominal boost frequencies; it only guarantees that it will reach the base continuity.

It's worth noting that both the flagship Core i9-12900K and special edition Core i9-12900KS hit up to 100C in our testing, and that's at typical performance levels.

The chip throttles itself down to stay in the 100C envelope, so an additional 5C of cooling capacity loss could translate into reduced performance at maximum load because the chip won't boost as much.

However, this does not fall within Intel's definition of not being in the information: Turbo Boost frequencies are not guaranteed.

As for the exotic lengths enthusiasts have gone to in order to regain performance, Intel very specifically states that this could void the warranty.

However, many other concerns are not addressed in Intel's initial statement: as you can see in the image above, our brother location anandtech He found that the condition could cause the LGA 1700 socket, and therefore the motherboard, to bend.

This is caused by the uncomfortable pressure that is exerted on the chip by the ILM (Independent Loading Mechanism) that is held in place to support the chip. sure in the plinth.

This mechanism only makes contact with the chip in a small area in the middle, which causes the deflection.

The warping of the motherboard near the socket creates concerns about long-term impact on the motherboard, as traces and other circuitry/SMDs could be damaged by the force of the motherboard bending.

Not to mention the potential for damage to the socket or chip due to improper mating.

We asked Intel the following questions and the answers are online:

• Are there any planned changes to the ILM design? This condition may only remain with some ILM editions. Can you confirm that these ILMs comply with the information?
• «Based on recent data, we are unable to attribute the IHS deflection variation to any specific distributor or plug mechanism. However, we are currently investigating any potential issues with our partners and customers in the area. service, and we will provide much more guidance on important resolutions as appropriate. —Intel representative for Tom's Hardware.

Many users report reduced heat transfer due to the deflection issue.

Which makes sense since it precisely hurts the IHS's ability to mate with the cooler. Would Intel RMA the chip if the match was poor enough to lead to thermal throttling?

• «This is estimated to be a minor IHS deviation and does not cause the processor to perform outside of specifications or prevent the processor from meeting published frequencies under appropriate performance conditions. We advise users who experience functional issues with their processors to contact Intel Customer Support.» —Intel Representative for Tom's Hardware.
• The chip offset problem also affects motherboards. As product Due to the deflection of the chip, the back of the socket ends up bending and consequently the motherboard. This exposes the opportunity for damage to traces passing through the motherboard PCB, etc. Is this condition also in the specifications?
• «When backplane deflection occurs on the motherboard, the deformation is due to the mechanical load that is put on the motherboard to make electrical contact between the CPU and the socket. There is no direct correlation between IHS deflection and backplane deflection, and they may both be caused by the mechanical load of the socket.» —Intel Rep for Tom's Hardware.

Intel says they continue to monitor the situation, but there are no planned changes to the socket design.

The Alder Lake chip deflection condition does not cause the motherboard to flex; instead, it is caused by the load holding the chip firmly in the socket.

That statement makes sense because of the fact that the chip Of course it is not the bending that causes it, but rather the force of the plinth.

However, the statement does not answer the question of whether this is in the cards or whether it could cause damage, raising concerns about a possible long-term impact on motherboard reliability.

Intel reiterates that Alder Lake's deflection condition is not a problem

But enthusiasts who want the best performance and cooling possible will obviously disagree that poor contact with a cramped processor and the resulting higher temperatures are all that's needed.

We have to keep the issue in context, as extra 5Cs probably won't impact performance enough to be a concern for the vast majority of users, but enthusiasts, performance enthusiasts, and extreme overclockers are of course more than willing to take extreme measures.

To regain those few extra degrees of cooling capacity.

The long-term implications of the motherboard could warrant further scrutiny.

We are checking with multiple vendors to see if we can get more information.

Fountain: Tom's Hardware.