Intel comments on Alder Lake flex

Intel comments on Alder Lake flex

Intel comments on Alder Lake warping and flexing issues, void of warranty with modifications.

Intel has finally given us some in-depth comment on a snag that has plagued its lineup of much newer chips: The Alder Lake processors that dominate our list of the best gaming CPUs have suffered a baffling snag for enthusiasts, Thanks to the new chips with their elongated design and how they sit in the socket, they have been known to bend and disfigure as soon as they are placed in the motherboard socket.

As you can see in the very short video now, this creates a gap that decreases contact between the cooler and the chip, ultimately making it difficult for the cooler to keep the chip cool.

This can lead to much higher chip temperatures (bump changes, typically around 5C).

The condition, referred to as 'folding', 'warping' or 'bowing' in PC enthusiast circles, is the result of tremendous pressure exerted on the middle of the chip causing the IHS (Integrated Heat Spreader) bends, often resulting in very creative resolution choices to make up for the inconvenience.

This can range from customers employing custom built gadgets to extreme overclockers like Splave cutting a socket off a motherboard to regain lost cooling ability.

Intel finally commented on the drawbacks, stating that this condition is not a drawback and that changing the socket may void the chip's warranty.

Has said to Tom's Hardware:

“We're not getting any reports of 12th Gen Intel Core processors going out of the picture thanks to changes to the Inboard Heatsink (IHS).

Our internal notes detail that the IHS on 12th Gen desktop processors has the potential for rapid drift after installation in the socket.

Such deflection is estimated to be minor and does not cause the processor to be out of specification.

We strongly advise against making any edits to the socket or the load mechanism without dependency.

These edits would result in the processor being out of data and have the potential to void product warranties."

—Intel representative to Tom's Hardware.

Intel's statement admits that the condition exists but states that it does not cause performance issues.

However, it is essential to take these comments in context: First, deviation is a engineering term to detail “the level at which part of a structural factor moves under a load (because it disfigures)”, with which this is the technical term for what the social network of enthusiasts calls “bend”, “warp” or “ fold". .'

Next, Intel's statement that it has received no reports of chips running out of spec means that the deviation does not cause the chip to run hotter than the maximum temperature of 100°C and that any increased thermal temperatures it does not cause the chip to drop below its base continuity.

That's not to say there isn't a cooling hitch, it's just not serious enough for the chip to run out of information.

However, there are some nuances in Intel's definition of detailed performance: Intel It is not guarantees that it will reach the nominal boost frequencies; it only guarantees that it will reach base continuity.

It's worth noting that the flagship Core i9-12900K and the private edition Core i9-12900KS reached up to 100C in our tests, and that's across typical performance.

The chip ramps itself down to sustain itself in the 100C envelope, so an ancillary 5C of cooling ability loss could be in lower performance at max load due to the fact that the chip isn't going to ramp up as much.

However, this does not fall under Intel's definition of not being in the reports: Turbo Boost frequencies are not guaranteed.

When it comes to the exotic lengths that enthusiasts went to to regain performance, Intel very accurately states that this could void the warranty.

However, many other concerns are not addressed in Intel's initial statement: as you can see in the image above, our sibling location anandtech noted that the condition could cause the LGA 1700 socket, and thus the motherboard, to bend.

This is caused by the uncomfortable pressure being exerted on the chip in the ILM (Independent Loading Mechanism) being held to hold the chip securely in the socket.

This mechanism only makes contact with the chip in a small area in the middle, which causes the deflection.

The deformation of the motherboard near the socket raises concerns about long-term shock to the motherboard, as the traces and other circuits/SMD could be damaged by the force of the motherboard bending.

That's not even mentioning the potential for chip or socket damage from improper mating.

We asked Intel the following questions and the answers are online:

• Are there any planned changes to the ILM design? Possibly this condition only remains with some editions of the ILM. Can you confirm that these ILMs comply with the information?
• “Based on recent data, we are unable to attribute the IHS deflection variation to any particular distributor or plug mechanism. However, we are reviewing any potential issues attached with our service partners and customers, and will provide further guidance on important resolutions as appropriate." —Intel representative for Tom's Hardware.

Many users report reduced heat transfer due to the deflection issue.

Which makes sense since it specifically impairs the IHS's ability to mate with the cooler. Would Intel RMA the chip if the pairing was poor enough to lead to thermal throttling?

• “A minor IHS deflection is estimated and does not cause the processor to go out of information or prevent the processor from meeting published frequencies under the correct performance conditions. We advise individuals who observe functional issues with their processors to contact Intel Customer Service." —Intel representative for Tom's Hardware.
• The drawback of chip drift also hurts motherboards. As a product of chip deflection, the back of the socket ends up bending, and thus the motherboard. This exposes the opportunity for traces going through the motherboard PCB etc. to be damaged. Is this condition also in the information?
• “The moment a backplate flex is generated on the motherboard, the deformation is due to the mechanical load that is put on the motherboard to make electrical contact between the CPU and the socket. There is no direct correlation between IHS deviation and posterior plate flexion, plus they both have the possibility of being caused by mechanical loading of the socket.” —Intel representative for Tom's Hardware.

Intel states that they continue to monitor the situation, but there are no planned changes to the socket design.

The Alder Lake chip deflection condition does not cause motherboard bending; instead, it is caused by the charge holding the chip firmly in the socket.

That statement makes sense due to the fact that the chip of course does not cause the flex, but rather the force of the socket.

However, the statement doesn't answer the question of whether this is in the news or could cause damage, leaving concerns about a possible long-term bump in motherboard reliability.

Intel reiterates that Alder Lake's deflection condition is not a problem

But enthusiasts who want the best possible performance and cooling will of course disagree that poor contact with a damaged processor and the resulting higher temperatures are special.

We must keep the drawback in context, in that ancillary 5Cs probably won't affect performance enough to be a concern for the vast majority of customers, but enthusiasts, performance junkies, and extreme overclockers are of course more than willing. to take extreme measures.

To regain those extra few degrees of cooldown ability.

The long-term implications of the motherboard might warrant further scrutiny.

We track multiple dealers to see if we have a chance to get a lot more information.

Fountain: Tom's Hardware.